Overview
A quick drying, no-clean flux for use when removing or replacing surface mount components. Applying the flux to solder joints will aid re-flow when heating the joint to remove the component, or it can be applied to bare copper or tinned tracks providing excellent solderability. Dries in 5 to 10mins. Handy 12ml pen with chisel tip.
Specifications
Service Aid Chemicals
- Service Aid - Flux
- Physical state - Liquid Pen
- Net Volume - 12.0 ml
- Chemical container type - Pen
Product Dimensions
- Weight - 10.0 g
- Liquid Volume - 12.0 ml
